Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
防水積層構造及びその製造方法
Document Type and Number:
Japanese Patent JP6668196
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a waterproof multilayer structure improved in crack followup ability of a substrate even at a low temperature.SOLUTION: The present invention relates to a waterproof multilayer structure that is provided between a substrate and a pavement material. The waterproof multilayer structure includes a waterproof layer and an adhesive protection layer successively from a substrate side. In the waterproof multilayer structure, the waterproof layer is a coating membrane of a resin composition for waterproof layer. Regarding the resin composition for waterproof layer, the cured substance thereof has 80% or more tensile break elongation that is measured at -10°C in accordance with a measurement method regulated by JIS K6251:2010. The adhesive protection layer is a coating membrane of which a coating amount of a resin composition for adhesive protection layer ranges from 0.2 to 0.5 kg/m(excluding aggregates), and includes 0.5 to 2.0 kg/mof aggregates. Regarding the resin composition for adhesive protection layer, the cured substance thereof has 10% or more tensile break elongation that is measured at -10°C in accordance with a measurement method regulated by JIS K6251:2010, and has 100% or more tensile break elongation that is measured at 23°C.SELECTED DRAWING: Figure 1

Inventors:
Yujiro Yoshii
Kazuhiko Iwasaki
Kazuyoshi Shima
Application Number:
JP2016157626A
Publication Date:
March 18, 2020
Filing Date:
August 10, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Ryoaki Co., Ltd.
International Classes:
E01C7/30; B32B11/04; B32B27/00; B32B27/30; E04D7/00
Domestic Patent References:
JP2015227025A
JP2004066777A
JP2009256505A
Foreign References:
US20140162520
Attorney, Agent or Firm:
Akio Miyazaki
Masaaki Ogata