Title:
半導体ウエハ支持基板
Document Type and Number:
Japanese Patent JP6675577
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor wafer support substrate high in elasticity modulus and capable of preventing warpage with wafer thinning.SOLUTION: A substrate is constituted by crystallization of a LiO-AlO-SiO-based crystallized glass with the deposition of a β-quartz solid solution as a main crystal and containing, by mass% as a glass composition, SiOof 55 to 75%, AlOof 15 to 25%, LiO of 2 to 5%, NaO of 0 to 1%, KO of 0 to 1%, MgO of 0 to 3%, BaO of 0 to 2%, TiOof 1 to 3%, ZrOof 0 to 3%, TiO+ZrOof 3 to 5%, POof 0 to 3%, SnOof 0.1 to 0.5% or the like.SELECTED DRAWING: None
Inventors:
Nishida Shinsaku
Application Number:
JP2015019843A
Publication Date:
April 01, 2020
Filing Date:
February 04, 2015
Export Citation:
Assignee:
Nippon Electric Glass Co., Ltd.
International Classes:
C03C10/14; C03C3/083; H01L21/304; H01L21/683
Domestic Patent References:
| JP2007254279A | ||||
| JP2004523446A | ||||
| JP2006056745A | ||||
| JP2015020944A | ||||
| JP2001048582A | ||||
| JP2011111364A | ||||
| JP7263318A | ||||
| JP2005145813A |
Foreign References:
| WO2013171288A1 |