Title:
基板処理装置
Document Type and Number:
Japanese Patent JP6713893
Kind Code:
B2
Abstract:
The purpose of the present invention is to provide technology for suppressing the soiling of substrates. A substrate processing device comprises a substrate holding unit for holding a substrate horizontally, a processing liquid supply unit for supplying processing liquid toward the substrate held by the substrate holding unit, and a liquid receiving unit that surrounds the substrate holding unit and receives processing liquid which has splashed off of the substrate. The inner peripheral surface of the liquid receiving unit has a plurality of grooves exposed toward the substrate held by the substrate holding unit, and the direction of extension of the plurality of grooves includes vertical-direction components. As a result, droplets of processing liquid readily collect in the grooves and fall due to the weight of the droplets.
Inventors:
Tatsuhiro Suzuki
Kentaro Satoshi
Takashi Nishimura
Yuki Kaaki
Yasuto Tamaki
Nobuyuki Miyaji
Tomomi Hirashita
Hiroaki Uchida
Yousuke Okutani
Kentaro Satoshi
Takashi Nishimura
Yuki Kaaki
Yasuto Tamaki
Nobuyuki Miyaji
Tomomi Hirashita
Hiroaki Uchida
Yousuke Okutani
Application Number:
JP2016186534A
Publication Date:
June 24, 2020
Filing Date:
September 26, 2016
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/304
Domestic Patent References:
| JP2005019675A | ||||
| JP2015050263A |
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita