Title:
プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法
Document Type and Number:
Japanese Patent JP6717835
Kind Code:
B2
Abstract:
A substrate for a printed circuit board according to an embodiment of the present invention includes a base film and a metal layer disposed on at least one of surfaces of the base film. In the substrate for a printed circuit board, an amount of nitrogen present per unit area, the amount being determined on the basis of a peak area of a Nls spectrum in XPS analysis of a surface of the base film exposed after removal of the metal layer by etching with an acidic solution, is 1 atomic% or more and 10 atomic% or less.
Inventors:
Yuichiro Yamanaka
Yoshio Oka
Satoshi Kitani
Yoshifumi Uchida
Makoto Nakabayashi
Yoshio Oka
Satoshi Kitani
Yoshifumi Uchida
Makoto Nakabayashi
Application Number:
JP2017536723A
Publication Date:
July 08, 2020
Filing Date:
August 06, 2016
Export Citation:
Assignee:
Sumitomo Electric Industries, Ltd.
Sumitomo Electric Print Circuit Co., Ltd.
Sumitomo Electric Fine Polymer Co., Ltd.
Sumitomo Electric Print Circuit Co., Ltd.
Sumitomo Electric Fine Polymer Co., Ltd.
International Classes:
H05K3/38; H05K1/03
Domestic Patent References:
| JP2015115422A | ||||
| JP2008063560A | ||||
| JP2014111815A | ||||
| JP2015127660A |
Attorney, Agent or Firm:
Hajime Amano