Title:
ドライフィルム、硬化物およびプリント配線板
Document Type and Number:
Japanese Patent JP6767153
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a dry film having a resin layer excellent in stick-peeling prevention property, temporal adhesion property and reworkability, a cured product obtained by curing the resin layer of the dry film, and a printed wiring board including the cured product.SOLUTION: The dry film has a first film, a second film, and a resin layer interposed between the first film and the second film. The second film has an arithmetic average surface roughness Ra of 0.1 μm or more on the surface in contact with the resin layer. The resin layer has a glass transition temperature (Tg) of 10 to 30°C; and a proportion x on a mass basis of an organic component having Tg of lower than 0°C with respect to organic components in the resin layer, and a proportion y of an inorganic filler in the resin layer satisfy x/y=0.2 to 1.0. The surface of the resin layer in contact with the second film is a lamination surface to a substrate.SELECTED DRAWING: Figure 1
Inventors:
Kazuya Okada
Ueda Chiho
Takeshi Yoda
Nobuto Ito
Ueda Chiho
Takeshi Yoda
Nobuto Ito
Application Number:
JP2016087445A
Publication Date:
October 14, 2020
Filing Date:
April 25, 2016
Export Citation:
Assignee:
Taiyo Ink Manufacturing Co., Ltd.
International Classes:
G03F7/004; B32B27/18; B32B27/20; H05K3/28
Domestic Patent References:
| JP2016035042A | ||||
| JP2006201546A | ||||
| JP2016511314A | ||||
| JP2007219334A | ||||
| JP5876182B2 | ||||
| JP2014186060A |
Attorney, Agent or Firm:
Ichiro Honda
Yumiko Sugimoto
Watari Takumi
Takashi Otaguro
Yumiko Sugimoto
Watari Takumi
Takashi Otaguro