Title:
部品実装装置
Document Type and Number:
Japanese Patent JP6781326
Kind Code:
B2
Abstract:
This component mounting device comprises a head, said head having an acquisition member that acquires a component, a plurality of holders that retain the acquisition member, and a plurality of raising/lowering devices that raise and lower the holders. The plurality of holders are structured such that each holder has different characteristics. Alternatively, the plurality of raising/lowering devices are structured such that each raising/lowering device has different characteristics. Consequently, the component mounting device can, with a single head, appropriately perform acquisition actions and mounting actions for different types of components, by selectively using a holder or a raising/lowering device, among the plurality of holders or the plurality of raising/lowering devices, that has characteristics corresponding to the type of component that is to be mounted.
Inventors:
Shigeto Oyama
Atsushi Iisaka
Atsushi Iisaka
Application Number:
JP2019500949A
Publication Date:
November 04, 2020
Filing Date:
February 24, 2017
Export Citation:
Assignee:
Fuji corporation
International Classes:
H05K13/04
Domestic Patent References:
| JP2013254785A | ||||
| JP2014067860A |
Foreign References:
| WO2014080472A1 | ||||
| WO2016189678A1 |
Attorney, Agent or Firm:
Aitec International Patent Office