Title:
回路モジュールおよび回路モジュールの製造方法
Document Type and Number:
Japanese Patent JP6787413
Kind Code:
B2
Abstract:
A circuit module (100) includes a substrate (1), on one principal surface of which a first wiring pattern (2) is provided, first electronic components (3-6) constituting a first electronic circuit together with the first wiring pattern (2), a plurality of connection conductors (8), a plurality of external connection terminals, a first resin layer (9), and a second resin layer (12). At least one of the plurality of connection conductors (8) includes a first columnar conductor (8a) extending in a normal line direction of the one principal surface of the substrate (1), and a plate-like conductor (8b) extending in a direction parallel to the one principal surface of the substrate (1). At least one of the plurality of external connection terminals is a second columnar conductor (11) extending in the normal line direction of the one principal surface of the substrate (1).
Inventors:
Kazushige Sato
Atsushi Toshima
Yuya Eshita
Nobumitsu Tenchi
Atsushi Toshima
Yuya Eshita
Nobumitsu Tenchi
Application Number:
JP2018568019A
Publication Date:
November 18, 2020
Filing Date:
December 21, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01L23/12; H01L21/56
Domestic Patent References:
| JP2014110337A | ||||
| JP2009289866A | ||||
| JP2011243922A |
Foreign References:
| WO2013035655A1 |
Attorney, Agent or Firm:
Fukami patent office