Title:
基板保持器受入れ装置
Document Type and Number:
Japanese Patent JP6813490
Kind Code:
B2
Abstract:
This invention concerns a substrate holder reception apparatus (1) for clamping a substrate holder (11) in a substrate holder clamping direction (SHCD) in a predetermined position of the substrate holder (11) and releasing the substrate holder (11), comprising at least one substrate holder connection device (21) for mechanical aligning and electrically contacting of the substrate holder (11), wherein the substrate holder connection device (21) comprises a separate substrate holder alignment device (211) for aligning the substrate holder (11) with the substrate holder connection device (21) in an alignment direction, and a separate substrate holder contact device (212) for electrically contacting the substrate holder (11). Further, the invention concerns an electrochemical treatment apparatus (5) comprising the substrate holder reception apparatus (1).
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Inventors:
Ralph Lauen Bush
Tobias Bussenius
Stephan vittum
Tobias Bussenius
Stephan vittum
Application Number:
JP2017535081A
Publication Date:
January 13, 2021
Filing Date:
August 04, 2016
Export Citation:
Assignee:
Atotech Deutschland GmbH
International Classes:
C25D17/08; H01L21/677
Domestic Patent References:
| JP2009155726A | ||||
| JP2014185375A | ||||
| JP2015179747A | ||||
| JP2008069433A | ||||
| JP2007291463A |
Foreign References:
| US5522975 | ||||
| EP2813602A1 | ||||
| CN101451264A | ||||
| US20090139871 |
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Morita Taku
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima
Morita Taku
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima