Title:
実装装置
Document Type and Number:
Japanese Patent JP6816992
Kind Code:
B2
Abstract:
Provided is a mounting device which is not susceptible to generating mounting quality differences among positions within a semiconductor wafer surface, while ensuring alignment accuracy of thermocompression bonding positions, at the time of mounting, by means of thermocompression bonding, semiconductor chips that have been temporarily fixed on a semiconductor wafer substrate. Specifically, the mounting device is provided with: a holding section that partially holds the semiconductor wafer substrate; a bonding head that bonds the semiconductor chips, by means of thermocompression bonding, to the semiconductor wafer substrate being held by the holding section; and a backup stage that supports, in a region where the bonding head performs the thermocompression bonding, the semiconductor wafer substrate from the surface on the reverse side. The holding section has a suction means for sucking the semiconductor wafer substrate surface on the reverse side, said suction means being configured from a member having a heat conductivity of 1 W/mK or lower.
Inventors:
Yoshito Mizutani
Noboru Asahi
Shoji Nimura
Noboru Asahi
Shoji Nimura
Application Number:
JP2016155221A
Publication Date:
January 20, 2021
Filing Date:
August 08, 2016
Export Citation:
Assignee:
Toray Engineering Co., Ltd.
International Classes:
H01L21/60; H05K13/04
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