Title:
リードフレーム
Document Type and Number:
Japanese Patent JP6825436
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a lead frame in which residual stress is suppressed.SOLUTION: A lead frame includes a unit having a first lead 21a and a second lead 22a not linked each other in a first direction, multiple units arranged in the first direction and a second direction orthogonal to the first direction, multiple first links for linking the units adjoining in the first direction, multiple second links for linking the units adjoining in the second direction, a first ridge having a corner at the upper end of profile of a fist link 25 in the first direction, and a second ridge having a flexure shape on the upper surface of profile of a second link 23 in the second direction. On the lower surface, the fist link 25 and the second link 23 are located below the first ridge or the second ridge, and have a recess recessed from the lower surface to the upper surface.SELECTED DRAWING: Figure 2C
Inventors:
Okudainao
Toshiyuki Hashimoto
Yoshihiro Isono
Takao Ishihara
Takaaki Kato
Toshiyuki Hashimoto
Yoshihiro Isono
Takao Ishihara
Takaaki Kato
Application Number:
JP2017053209A
Publication Date:
February 03, 2021
Filing Date:
March 17, 2017
Export Citation:
Assignee:
Nichia Corporation
International Classes:
H01L23/50; H01L33/62
Domestic Patent References:
| JP2012089547A | ||||
| JP2008300504A | ||||
| JP2017011097A | ||||
| JP2012216785A | ||||
| JP2015103618A | ||||
| JP2013165221A | ||||
| JP2010040595A |
Attorney, Agent or Firm:
Seiji Okuda
Osamu Kita
Michi Kajitani
Akiko Miyake
Yu Tanaka
Osamu Kita
Michi Kajitani
Akiko Miyake
Yu Tanaka