Title:
発光装置の製造方法
Document Type and Number:
Japanese Patent JP6825557
Kind Code:
B2
Abstract:
Provided is a sealing material for sealing in a light-emitting element, the sealing material having a bonding surface that can be in contact with the light-emitting element, an arithmetic mean roughness of the bonding surface being 10 nm or greater and 1000 nm or less. A storage elastic modulus of the sealing material at 90'C is preferably 10 MPa or greater. The sealing material preferably contains a metal compound. A method for manufacturing a light-emitting device of the present invention includes a step
for bonding the bonding surface of the sealing material to the light-emitting element, and a step for bonding a barrier member to a surface of the sealing material opposite to the bonding surface.
Inventors:
Kenichi Harai
Application Number:
JP2017508461A
Publication Date:
February 03, 2021
Filing Date:
March 25, 2016
Export Citation:
Assignee:
Zeon Corporation
International Classes:
H05B33/04; G09F9/30; H01L27/32; H01L51/50; H05B33/10
Domestic Patent References:
| JP2008226471A | ||||
| JP2005306946A | ||||
| JP2006272190A | ||||
| JP2014529653A |
Foreign References:
| US20130140545 |
Attorney, Agent or Firm:
Sakai International Patent Office