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Patent Searching and Data


Title:
銅−セラミック複合材
Document Type and Number:
Japanese Patent JP6829261
Kind Code:
B2
Abstract:
The invention relates to a copper-ceramic composite, comprising a ceramic substrate, which contains aluminum oxide, a coating on the ceramic substrate made of copper or a copper alloy, wherein the aluminum oxide has an average grain form factor Ra(Al2O3), determined as an arithmetic average value from the form factors of the grains of the aluminum oxide, the copper or the copper alloy has an average grain form factor Ra(Cu), determined as an arithmetic average of the form factors of the grains of the copper or copper alloy, and the average grain form factors of the aluminum oxide and copper or copper alloy meet the following condition: 0.5≤Ra(Al2O3)/Ra(Cu)≤2.0.

Inventors:
Help storage
Muschel Knaut Christian
Log alexander
Application Number:
JP2018544125A
Publication Date:
February 10, 2021
Filing Date:
February 16, 2017
Export Citation:
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Assignee:
Heraeus Deutschland GM Behr und Company Carge
International Classes:
C04B37/02; C04B35/111; H01L23/36; H05K1/03
Domestic Patent References:
JP2014222619A
JP2004221547A
JP2015534280A
JP62282797A
JP2014114201A
Foreign References:
WO2013008919A1
WO2006042766A1
WO2013015355A1
Attorney, Agent or Firm:
Janggi Motonori
Hiroshi Suzuki