Title:
電鋳用原盤およびその電鋳用原盤を用いた電鋳モールドの製造方法
Document Type and Number:
Japanese Patent JP6844010
Kind Code:
B2
Abstract:
Provided are an electroforming master that does not cause distortion in an electroforming mold, and a method for manufacturing an electroforming mold. In the present invention, an electroforming master having a relief pattern on a surface thereof is configured so as to be provided with a substrate having a flat surface and a Young's modulus of 50 GPa or greater, and a pattern film which has a Young's modulus of 10 GPa or less and in which a relief pattern is formed on the surface thereof. The flat surface of the substrate and the surface of the pattern film not provided with the relief pattern are affixed together by an adhesive layer over the entire surface thereof, the adhesion strength between the substrate and the pattern film due to the adhesive layer being 0.01 N/25 mm to 10 N/25 mm, or greater than 10 N/25 mm, and the adhesion strength being reducible to 10 N/25 mm or less by light irradiation or heat treatment of the adhesive layer.
More Like This:
Inventors:
Tomoichi Umezawa
Noboru Kawasaki
Takashi Shimizu
Noboru Kawasaki
Takashi Shimizu
Application Number:
JP2019539417A
Publication Date:
March 17, 2021
Filing Date:
August 22, 2018
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
C25D1/10; C25D1/00; C25D1/20
Domestic Patent References:
| JP2003105583A | ||||
| JP2005139510A | ||||
| JP2005264220A |
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office