Title:
プラズマ処理装置及びプラズマ処理方法
Document Type and Number:
Japanese Patent JP6850830
Kind Code:
B2
Abstract:
Provided is a plasma processing apparatus capable of implementing both a radical irradiation step and an ion irradiation step using a single apparatus and controlling the ion irradiation energy from several tens eV to several KeV.The plasma processing apparatus includes a mechanism (125, 126, 131, 132) for generating inductively coupled plasma, a perforated plate 116 for partitioning the vacuum processing chamber into upper and lower areas 106-1 and 106-2 and shielding ions, and a switch 133 for changing over between the upper and lower areas 106-1 and 106-2 as a plasma generation area.
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Inventors:
Naoyuki Koto
Masashi Mori
Toshiaki Nishida
Ryoji Hamasaki
Masashi Mori
Toshiaki Nishida
Ryoji Hamasaki
Application Number:
JP2019124995A
Publication Date:
March 31, 2021
Filing Date:
July 04, 2019
Export Citation:
Assignee:
Hitachi High-Tech Co., Ltd.
International Classes:
H01L21/3065; H05H1/46
Domestic Patent References:
| JP3218018A | ||||
| JP2230729A | ||||
| JP2015065434A | ||||
| JP2010538489A | ||||
| JP2072620A | ||||
| JP4225226A | ||||
| JP2014036034A |
Attorney, Agent or Firm:
Polaire Patent Business Corporation