Title:
プリプレグ、金属張積層板及びプリント配線板
Document Type and Number:
Japanese Patent JP6861377
Kind Code:
B2
Abstract:
A prepreg including: a woven cloth substrate; and a semi-cured product of a resin composition. The resin composition contains: at least one of an (A1) component and an (A2) component, a (B) component; a (C1) component; and a (C2) component. The (A1) component is an epoxy resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (A2) component is a phenol resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (B) component is a high molecular weight polymer. The (C1) component is a first filler obtained by treating surfaces of a first inorganic filler with a first silane coupling agent represented by formula (c1). The (C2) component is a second filler obtained by treating surfaces of a second inorganic filler with a second silane coupling agent represented by formula (c2).
Inventors:
Keiko Kashihara
Takanori Hoshi
Hiroshi Inoue
Takanori Hoshi
Hiroshi Inoue
Application Number:
JP2018529808A
Publication Date:
April 21, 2021
Filing Date:
July 19, 2017
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
C08J5/24; B32B15/08; B32B15/092; C08L63/00; H05K1/03
Domestic Patent References:
| JP2015189834A | ||||
| JP2015082535A | ||||
| JP2014070156A | ||||
| JP2011162615A | ||||
| JP2016210856A |
Foreign References:
| WO2016031205A1 | ||||
| WO2014141689A1 |
Attorney, Agent or Firm:
Patent business corporation Hokuto patent office