Title:
高集積密度を有するＭＥＭＳ部品
Document Type and Number:
Japanese Patent JP6873908
Kind Code:
B2
Abstract:
A MEMS component having increased integration density and a method for manufacturing such a component are specified. The component comprises a base wafer and a cover wafer arranged over this. A first cavity is arranged between the base wafer and the cover wafer. A second cavity is arranged over the cover wafer, below a thin-layer covering. The cavities contain component structures.
Inventors:
Metzger, Thomas
Portman, Jurgen
Portman, Jurgen
Application Number:
JP2017545341A
Publication Date:
May 19, 2021
Filing Date:
December 18, 2015
Export Citation:
Assignee:
EPCOS AG
International Classes:
B81B7/02; B81C3/00; H01L25/10; H01L25/18; H03H3/02; H03H3/08; H03H9/17; H03H9/25
Domestic Patent References:
| JP2016515331A | ||||
| JP2014120966A | ||||
| JP2016510192A | ||||
| JP563482A | ||||
| JP11103228A | ||||
| JP201331030A | ||||
| JP200760465A |
Foreign References:
| DE102013102206A1 | ||||
| DE102013102210A1 | ||||
| US20150380634 | ||||
| DE102011112476A1 | ||||
| US8786130 |
Attorney, Agent or Firm:
Kurata Masatoshi
Morisezo Iseki
Takashi Okada
Morisezo Iseki
Takashi Okada