Title:
薄いフォームファクタで低コスト設計を可能にするファスナレスヒンジ
Document Type and Number:
Japanese Patent JP6873912
Kind Code:
B2
Abstract:
The present disclosure includes a fastenerless hinge system which enables a thin form factor low cost design. A hinge system described herein may include a hinge bracket and a hinge wing. The hinge bracket includes an elevated portion thereby providing a hollow region and one or more spring tabs. The hinge wing is slidably coupled to the hinge bracket through the hollow portion. Advantageously, a hinge system consistent with the present disclosure does not include fasteners such that the “Z” height of the computing device may be minimized in addition to reducing costs.
Inventors:
Spranger, Mark
Arik, Kenan
Dam, drew
Arik, Kenan
Dam, drew
Application Number:
JP2017553229A
Publication Date:
May 19, 2021
Filing Date:
June 27, 2016
Export Citation:
Assignee:
INTEL CORPORATION
International Classes:
G06F1/16; E05D7/12; F16C11/04; F16C11/10; H05K5/02
Domestic Patent References:
| JP57199676U | ||||
| JP2005209156A | ||||
| JP2004046829A | ||||
| JP2005292490A | ||||
| JP2008186427A | ||||
| JP3145524U | ||||
| JP2003005660A | ||||
| JP2014152837A | ||||
| JP2010164076A | ||||
| JP2005276937A |
Foreign References:
| US20050188499 | ||||
| US5193308 |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation
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