Title:
導体とその製造方法、及びそれを用いた積層回路及び積層配線部材
Document Type and Number:
Japanese Patent JP6877345
Kind Code:
B2
Abstract:
Disclosed is a conductor (3) for electrically connecting a first conductive member (22) and a second conductive member (6) to each other by penetrating an insulating film (4) that is disposed between the first conductive member and the second conductive member. The conductor has a chevron shape, the value of height/bottom surface long axis length, i.e., the ratio of the height of the conductor to the long axis length of the bottom surface of the conductor, is 0.05-0.5, and the height of the conductor is 1.1-8 times the thickness of the insulating film.
Inventors:
Atsushi Yao
Application Number:
JP2017534107A
Publication Date:
May 26, 2021
Filing Date:
August 12, 2016
Export Citation:
Assignee:
IDEMITSU KOSAN CO.,LTD.
International Classes:
H01L21/768
Domestic Patent References:
| JP9232425A | ||||
| JP2013048181A | ||||
| JP6216258A | ||||
| JP2005101552A | ||||
| JP2010283194A | ||||
| JP7263571A | ||||
| JP2000208628A | ||||
| JP2007027367A |
Attorney, Agent or Firm:
Heiwa International Patent Office