Title:
配線基板
Document Type and Number:
Japanese Patent JP6881913
Kind Code:
B2
Abstract:
The invention provides a wiring substrate in which the size and the total number of elements to be mounted later are less likely to be restricted by the surface of a metallic heatsink inserted into a through hole penetrating between the front surface and the rear surface of the substrate body made from ceramic, and cracks and the like are less likely to occur in the vicinity of the joining part of the ceramic of the substrate body when the heatsink is brazed. The wiring substrate includes: a substrate body made from ceramic, having a front surface and a rear surface, and having a through hole penetrating between the front surface and the rear surface; and a heatsink inserted into the through hole. A step portion protruding in a direction perpendicular to an axial direction of the through hole, is formed over an entire periphery on an inner wall surface of the through hole of the substrate body. A flange opposed to the step portion is provided so as to protrude, over an entire periphery on a side surface of the heatsink. A stress relaxing ring is arranged over an entire periphery between the step portion and a joining surface opposed to the step portion. A brazing material is provided between the ring, and the joining surface and the step portion.
Inventors:
Kensuke Matsuhashi
Application Number:
JP2016158411A
Publication Date:
June 02, 2021
Filing Date:
August 12, 2016
Export Citation:
Assignee:
Nippon Special Ceramics Co., Ltd.
International Classes:
H05K1/02
Domestic Patent References:
| JP10321759A | ||||
| JP3054173A | ||||
| JP2003197800A | ||||
| JP2007311510A | ||||
| JP8008373A | ||||
| JP7086717A |
Attorney, Agent or Firm:
Suzuki Manabu
Yasushi Sakakibara
Yasushi Sakakibara