Title:
部品実装機
Document Type and Number:
Japanese Patent JP6886981
Kind Code:
B2
Abstract:
A component mounter provided with a first raising and lowering device configured to raise and lower a raising and lowering member, and a second raising and lowering device provided on the raising and lowering member and configured to relatively raise a suction nozzle with respect to the raising and lowering member. The component mounter performs, among multiple types of operations of lowering the suction nozzle, a cleaning operation of cleaning the suction nozzle and a discarding operation of discarding a component for which an error occurred via a first operation mode of lowering the suction nozzle by driving the first raising and lowering device (S120, S130, S140). Also, the component mounter performs pickup operation of picking up the component and mounting operation of mounting the component via a second operation mode of lowering the suction nozzle by driving the first raising and lowering device and the second raising and lowering device (S100, S110, S150).
Inventors:
Kohei Sugihara
Application Number:
JP2018540535A
Publication Date:
June 16, 2021
Filing Date:
September 21, 2016
Export Citation:
Assignee:
Fuji corporation
International Classes:
H05K13/04
Domestic Patent References:
| JP2002043336A |
Attorney, Agent or Firm:
Aitec International Patent Office