Title:
チップ移載部材、チップ移載装置、およびチップ移載方法
Document Type and Number:
Japanese Patent JP6900006
Kind Code:
B2
Abstract:
According to one embodiment, a chip transfer member includes a light-transmitting portion and a metal portion. The light-transmitting portion has a light incident surface, a light-emitting surface, and a side surface. The metal portion is provided at the side surface of the light-transmitting portion.
Inventors:
Yoichiro Kurita
Tomoyuki Abe
Hideto Koyama
Tomoyuki Abe
Hideto Koyama
Application Number:
JP2018024472A
Publication Date:
July 07, 2021
Filing Date:
February 14, 2018
Export Citation:
Assignee:
Toshiba Electronic Devices & Storage Corporation
Ayumi Industry Co., Ltd.
Ayumi Industry Co., Ltd.
International Classes:
H01L21/52
Domestic Patent References:
| JP2008535275A | ||||
| JP2006237504A | ||||
| JP2003204047A | ||||
| JP5127025A | ||||
| JP2005077764A | ||||
| JP2016092078A |
Attorney, Agent or Firm:
Masahiko Hinataji
Junichi Kozaki
Hiroshi Ichikawa
Tatsutetsu Shirai
Takato Uchida
Junichi Kozaki
Hiroshi Ichikawa
Tatsutetsu Shirai
Takato Uchida