Title:
スクライブ加工方法及びスクライブ加工装置
Document Type and Number:
Japanese Patent JP6904567
Kind Code:
B2
Abstract:
An object of the present invention is to form a scribing line on a glass substrate by one-scan laser processing even in the case of the glass substrate having a relatively large thickness. The scribing method of the present invention is a method for scribing a glass substrate G, and includes a scribing line forming step for forming a scribing line 31 by intermittently performing internal processing of the glass substrate G via irradiating a laser beam in a planar direction. A plurality of light converging points arranged on the optical axis of the laser beam are located inside the glass substrate G. The beam intensity of the first light converging point of the plurality of light converging points closest to the side opposite to the surface irradiated by the laser beam is higher than the beam intensity of the plurality of other light converging points. In addition, the plurality of other light converging points have uniform beam intensity, wherein the plurality of processing marks aligned along the optical axis can be uniformly formed inside the glass substrate. The beam intensity of the first light converging point is 1.8 to 2.8 times the beam intensity of the plurality of other light converging points. In the step of forming the scribing line, the plurality of light converging points are formed by using an aspheric lens. Alternatively, the plurality of light converging points are formed by using a spatial optical modulator and a condensing lens. According to the present invention, the scribing device comprises a laser device and a control unit for enabling the laser device to execute the scribing method. Thus, in the scribing method and scribing device of the present invention, the scribing line is formed by intermittently performing internal processing of the glass substrate via using a pulse of a laser device in a planar direction.
Inventors:
Hiroyoshi Hayashi
Ikusho Nakatani
Ikusho Nakatani
Application Number:
JP2017191500A
Publication Date:
July 21, 2021
Filing Date:
September 29, 2017
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
C03B33/037; B23K26/067; B23K26/53; B28D5/00; C03B33/09
Domestic Patent References:
| JP2007290932A | ||||
| JP2017122046A | ||||
| JP2017171530A | ||||
| JP201724083A | ||||
| JP2013193081A |
Foreign References:
| WO2003076120A1 | ||||
| WO2014156687A1 | ||||
| WO2009102002A1 | ||||
| WO2013027645A1 |
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation