Title:
ウエーハのうねり検出方法及び研削装置
Document Type and Number:
Japanese Patent JP6905357
Kind Code:
B2
Abstract:
When grinding a wafer with a grinding device, it is designed in such a way that wafer waviness detection can be carried out by another detection device without taking out the wafer from the grinding device, so as to prevent an increase of processes required by the processing. The wafer waviness detection method includes a holding step for holding a wafer (W) on a holding table (400), a contact step for making a flat transparent plate (50) in contact with the wafer (W) held by the holding table (400), and an irradiation step for irradiating light from the side of the transparent plate (50). The waviness of the wafer (W) can be detected according to an interference pattern (R) generated in the irradiation step.
Inventors:
Kiyono Atsushi
Application Number:
JP2017044796A
Publication Date:
July 21, 2021
Filing Date:
March 09, 2017
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B24B7/22; B24B49/12; B24B49/04; H01L21/304
Domestic Patent References:
| JP2004061378A | ||||
| JP2007255957A | ||||
| JP2005197578A | ||||
| JP2008155292A |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office