Title:
撮像装置
Document Type and Number:
Japanese Patent JP6908506
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate for an imaging apparatus, in which joining strength of a lid can be increased.SOLUTION: A substrate 10 for an imaging apparatus comprises: a ceramic wiring board 1; and a frame-like member 2. The ceramic wiring board 1 includes: base part 11 which has on the top surface thereof, a mounting region 1a of an imaging device 5 11 and has a rectangular shape in a plan view; and a frame body part 12 which is provided on the base part 11, surrounds the mounting region 1a and has a rectangular shape in a plan view. The frame-like member 2 is made of a metal, is joined through a joint member 7 to the top surface of the frame body part 12, and includes a projection part 2a projected to an outer side from a side surface of the ceramic wiring board 1. In the height of the top surface of the frame-like member 12 of the flame member 2, the height in a central part of the frame body part 12 is higher than that of a corner part of the frame body part 12.SELECTED DRAWING: Figure 3
Inventors:
Tomohiro Samejima
Application Number:
JP2017227940A
Publication Date:
July 28, 2021
Filing Date:
November 28, 2017
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L27/146; H01L23/02; H01L31/02; H04N5/335
Domestic Patent References:
| JP2013243339A | ||||
| JP2014192492A |
Foreign References:
| WO2013027669A1 |