Title:
半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP6926645
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device and a method of manufacturing the same capable of suppressing a region where a semiconductor element can be formed from narrowing.SOLUTION: Provided is a semiconductor device that comprises two substrates 11 and 21, and in which a rear face of one of the two substrates 11 and 21 is bonded with a surface of the other. The two substrates 11 and 21 are formed with alignment marks 16 and 26 that can be observed from lateral faces of the substrates 11 and 21, and are bonded with each other so that the alignment mark formed on one of the two substrates 11 and 21 corresponds to the alignment mark formed on the other.SELECTED DRAWING: Figure 1
Inventors:
Kameoka Hiro
Yoshihiro Murakami
Qin Takehiro
Yoshihiro Murakami
Qin Takehiro
Application Number:
JP2017092553A
Publication Date:
August 25, 2021
Filing Date:
May 08, 2017
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L21/60; H01L21/3205; H01L21/768; H01L23/12; H01L23/522
Domestic Patent References:
| JP2008135763A |
Foreign References:
| WO2007066409A1 |
Attorney, Agent or Firm:
Patent Business Corporation Yuai Patent Office