Title:
回路基板
Document Type and Number:
Japanese Patent JP6936028
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a circuit board capable of improving a packaging density of components by reducing a wasted space formed in a housing for accommodating electrical components.SOLUTION: A circuit board comprises substrates 21, 22 on which a circuit is installed in a divided manner and each of which is arranged to face each flat surface of a large-sized component such as a high-frequency transformer 13 and which are electrically connected with each other to enable combination of the substrates 21, 22. In the circuit board, components having comparatively small heights in a thickness direction are arranged on a specific substrate in a concentrative manner and higher components are arranged on another substrate. Accordingly, variation in component height is reduced in each substrate and a wasted space between each component and an opposite surface is reduced. Since an area of each of the substrates 21, 22 is reduced and each of the substrates 21, 22 does not project to the outside of the high-frequency transformer 13, the substrates 21, 22 can be accommodated in a smaller housing and the wasted space is eliminated so that a component packaging density of a whole device is improved.SELECTED DRAWING: Figure 1
Inventors:
Yasuhiro Okamoto
Application Number:
JP2017051548A
Publication Date:
September 15, 2021
Filing Date:
March 16, 2017
Export Citation:
Assignee:
Yazaki Corporation
International Classes:
H05K1/14; H01L25/07; H01L25/18; H02M3/28; H05K7/20
Domestic Patent References:
| JP59173366U | ||||
| JP2011108955A | ||||
| JP54574U | ||||
| JP201546447A |
Attorney, Agent or Firm:
Patent business corporation glory patent office