Title:
硬化物パターンの製造方法、光学部品、回路基板および石英モールドレプリカの製造方法、ならびにインプリント前処理コート用材料およびその硬化物
Document Type and Number:
Japanese Patent JP7328888
Kind Code:
B2
Abstract:
The method for fabricating pattern of a cured product includes a first step (arranging step) of arranging a layer formed of a liquid film of a curable composition (α1) containing at least a component (A1) serving as a polymerizable compound on a substrate and a second step (dispensing step) of dispensing liquid droplets of a curable composition (α2) containing at least a component (A2) serving as a polymerizable compound discretely onto a layer formed of a composition (α1′) of components of the curable composition (α1) except a component (D1) serving as a solvent, in which: the mixing of the composition (α1′) and the curable composition (α2) is exothermic.
Inventors:
Jun Kato
Toshiki Ito
Toshiki Ito
Application Number:
JP2019504552A
Publication Date:
August 17, 2023
Filing Date:
March 02, 2018
Export Citation:
Assignee:
Canon Inc
International Classes:
H01L21/027; B29C59/02
Domestic Patent References:
| JP201393552A | ||||
| JP200983172A | ||||
| JP2010258182A | ||||
| JP201628419A | ||||
| JP201526740A | ||||
| JP201356440A |
Attorney, Agent or Firm:
Okabe
Takao Ochi
Koji Yoshizawa
Aki Honda
Takao Ochi
Koji Yoshizawa
Aki Honda