Title:
半導体装置および電力変換装置
Document Type and Number:
Japanese Patent JP7329583
Kind Code:
B2
Abstract:
In this power semiconductor module, a first lead frame and a second lead frame through which currents flow in opposite directions are arranged so as to overlap each other, whereby the internal inductance can be reduced. In a direction perpendicular to one main surface of a first metal wiring layer, each of the first lead frame and the second lead frame is provided so as not to overlap parts of end surfaces of the first metal wiring layer and a second metal wiring layer. Thus, in a manufacturing process for the power semiconductor module before sealing with sealing resin, it is possible to easily perform positioning between the lead frames and between the metal wiring layer and the lead frame, using the end surfaces, whereby the manufacturing process can be simplified.
Inventors:
You Tanaka
Masakazu Tani
Tomohisa Yamane
Katsuhisa Kodama
Masakazu Tani
Tomohisa Yamane
Katsuhisa Kodama
Application Number:
JP2021202178A
Publication Date:
August 18, 2023
Filing Date:
December 14, 2021
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L25/07; H01L21/60; H01L23/48; H01L25/18
Domestic Patent References:
| JP2021034638A | ||||
| JP6972432B1 | ||||
| JP2014033096A |
Foreign References:
| US20170287820 |
Attorney, Agent or Firm:
Parumo Patent Attorneys Office