Title:
回転型めっき装置およびこれを用いためっき方法
Document Type and Number:
Japanese Patent JP7340441
Kind Code:
B2
Abstract:
To provide a rotary type plating apparatus and a plating method using the apparatus that can reduce plating failure due to insufficient compatibility between a plating solution and a to-be-plated object.SOLUTION: A rotary type plating apparatus 100 comprises: a disc-shaped bottom plate 2 rotatable around a vertical line axis; a truncated cone-shaped lid 1 integrally arranged on an outer peripheral side wall of the bottom plate 2; a plating tank 3 defined by the bottom plate 2 and the lid 1; an anode electrode 4 arranged substantially in the center of the plating tank 3; a cathode electrode 5 that is exposed to the inner peripheral side of the plating tank 3, and that constitutes part of the outer peripheral side wall; and a spray nozzle (discharge unit) 14 that is arranged in the plating tank 3 for injecting (or discharging) a plating solution 26 toward the outer peripheral side of the bottom plate 2.SELECTED DRAWING: Figure 7
Inventors:
Toshifumi Mizoue
Application Number:
JP2019229611A
Publication Date:
September 07, 2023
Filing Date:
December 19, 2019
Export Citation:
Assignee:
koa corporation
International Classes:
C25D17/22
Domestic Patent References:
| JP2006274412A | ||||
| JP2018178181A | ||||
| JP2002339100A | ||||
| JP2012097290A | ||||
| JP2012062566A | ||||
| JP2020506284A |
Foreign References:
| WO2008081536A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Takewa International Patent Office