Title:
ポータブル電子デバイスのための熱管理システム
Document Type and Number:
Japanese Patent JP7357081
Kind Code:
B2
Abstract:
A wearable electronic device is disclosed. The device can include a support structure and an electronic component disposed in or on the support structure. A heat exchanger element can be thermally coupled with the electronic component, the heat exchanger element comprising a fluid inlet port and a fluid outlet port. A first conduit can be fluidly connected to the fluid inlet port of the heat exchanger, the first conduit configured to convey, to the heat exchanger, liquid at a first temperature. A second conduit can be fluidly connected to the fluid outlet port of the heat exchanger, the second conduit configured to convey, away from the heat exchanger, liquid at a second temperature different from the first temperature.
Inventors:
Rohena, Guillermo Padin
Godil, Mohammed Amin
Kuteri, Anthony
Godil, Mohammed Amin
Kuteri, Anthony
Application Number:
JP2021569891A
Publication Date:
October 05, 2023
Filing Date:
May 27, 2020
Export Citation:
Assignee:
Magic Leap,Inc.
International Classes:
G06F1/20
Foreign References:
| US20160377328 | ||||
| US20060144568 | ||||
| US20040132171 |
Attorney, Agent or Firm:
Shusaku Yamamoto
Natsuki Morishita
Takatoshi Iida
Daisuke Ishikawa
Kensaku Yamamoto
Natsuki Morishita
Takatoshi Iida
Daisuke Ishikawa
Kensaku Yamamoto