Title:
接続体及び接続体の製造方法
Document Type and Number:
Japanese Patent JP7369756
Kind Code:
B2
Abstract:
To ensure the conductivity between an electronic component and a circuit board, and prevent a short circuit between the electrode terminals of the electronic component even when the wiring pitch of the circuit board or the electrode terminal of the electronic component are given a finer pitch.SOLUTION: In a connection body 10 in which an electronic component 18 is connected to a circuit board 12 via an anisotropic conductive adhesive 1, the anisotropic conductive adhesive 1 has conductive particles 4 regularly arranged in a binder resin 3, and a distance between the conductive particles 4 in a space 23 between the connection electrodes 19 formed on the electronic component 18 is longer than the distance between the conductive particles 4 captured between a substrate electrode 17 and a connection electrode 19 formed on the circuit board 12.SELECTED DRAWING: Figure 1
Inventors:
Kenichi Saruyama
Yasushi Akutsu
Yasushi Akutsu
Application Number:
JP2021187333A
Publication Date:
October 26, 2023
Filing Date:
November 17, 2021
Export Citation:
Assignee:
Dexerials Corporation
International Classes:
H01L21/60; C09J7/35; C09J9/02; C09J11/04; C09J201/00; H05K3/32
Domestic Patent References:
| JP2007035743A | ||||
| JP10308414A | ||||
| JP2007165052A | ||||
| JP9320345A | ||||
| JP5082199A |
Attorney, Agent or Firm:
Nobuhiro Noguchi