Title:
熱電モジュール、及び熱電モジュール用ポストの製造方法
Document Type and Number:
Japanese Patent JP7373353
Kind Code:
B2
Abstract:
A thermoelectric module includes: a lower substrate; an upper substrate that is disposed above the lower substrate and faces the lower substrate; a plurality of p-type and n-type thermoelectric elements that are disposed between the lower substrate and the upper substrate; a first electrode that is disposed on an upper surface of the lower substrate and a lower surface of the upper substrate and forms a series circuit by alternately and sequentially connecting the p-type and n-type thermoelectric elements; and a second electrode that is provided on the lower substrate and connects a thermoelectric element at an end portion of the series circuit and a post. The post includes a post main body that is formed of titanium, and a titanium passive film that covers a side surface of the post main body.
Inventors:
Hiroyuki Matsunami
Tetsushi Tanaka
Tetsushi Tanaka
Application Number:
JP2019189373A
Publication Date:
November 02, 2023
Filing Date:
October 16, 2019
Export Citation:
Assignee:
Kelk corporation
International Classes:
H10N10/82; H10N10/01
Domestic Patent References:
| JP2003008084A | ||||
| JP2005050862A | ||||
| JP2002374008A | ||||
| JP2004281930A | ||||
| JP2006332443A | ||||
| JP10173244A |
Foreign References:
| KR1020180128186A |
Attorney, Agent or Firm:
Patent Attorney Shiga International Patent Office