Title:
エポキシ樹脂組成物
Document Type and Number:
Japanese Patent JP7389815
Kind Code:
B2
Abstract:
Provided is an epoxy resin composition having good fluidity, and exhibiting excellent reliability for electronic components such as a semiconductor. The present invention is an epoxy resin composition containing an imidazolium salt (S), an epoxy resin (C), and a curing agent (D), the imidazolium salt (S) comprising an imidazolium cation (A) represented by the general formula (1) and at least one anion (B) selected from the group consisting of an carboxylate anion and a phenoxide anion. [In the formula (1), R1 represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a butyl group; R2 and R3 each represent a methyl group, an ethyl group, a propyl group, or a butyl group, and may be either the same as or different from each other; and R4 and R5 each represent a hydrogen atom, a methyl group, or an ethyl group, and may be either the same as or different from each other.]
Inventors:
Yoshihiko Akazawa
Atsushi Funayama
Atsushi Funayama
Application Number:
JP2021555911A
Publication Date:
November 30, 2023
Filing Date:
September 03, 2020
Export Citation:
Assignee:
San-Apro Co., Ltd.
International Classes:
C08G59/68; C08G59/40
Domestic Patent References:
| JP2019014781A | ||||
| JP2019523322A | ||||
| JP2015209492A | ||||
| JP2010529271A |
Foreign References:
| WO2009014270A1 |
Attorney, Agent or Firm:
Hiroshi Hayashi