Title:
光源装置
Document Type and Number:
Japanese Patent JP7417045
Kind Code:
B2
Abstract:
To provide a light source device that can be improved in heat dissipation.SOLUTION: A light source device 100 of the disclosure includes a first submount 20 having a first mounting surface 20a, a second submount 21 having a second mounting surface 21b, and a first laser diode 30A and a second laser diode 30B which are located between the first and second submounts. One of a p-side electrode surface 31b and n-side electrode surface 32a of a first laser diode is in contact with the first mounting surface, one of a p-side electrode surface 31b and n-side electrode surface 32a of a second laser diode 30B is in contact with the second mounting surface, the other of the p-side electrode surface and n-side electrode surface of the first laser diode is in contact with the second mounting surface via a first conductive member 40, and the other of the p-side electrode surface and n-side electrode surface of the second laser diode is in contact with the first mounting surface via a second conductive member 41.SELECTED DRAWING: Figure 2
Inventors:
Tadaaki Miyata
Application Number:
JP2019192604A
Publication Date:
January 18, 2024
Filing Date:
October 23, 2019
Export Citation:
Assignee:
Nichia Corporation
International Classes:
H01S5/02257; H01S5/02208; H01S5/024; H01S5/042; H01S5/40
Domestic Patent References:
| JP1181490A | ||||
| JP2004179607A | ||||
| JP2005353614A |
Foreign References:
| WO2019003546A1 | ||||
| US9450377 | ||||
| CN105720477A |
Attorney, Agent or Firm:
Seiji Okuda