Title:
撮像モジュール及び組立方法
Document Type and Number:
Japanese Patent JP7441976
Kind Code:
B2
Abstract:
A camera module and an assembling method. The camera module comprises a lens (1), a connecting member (2), a circuit board (3), and a photoelectric imaging sensor provided on the circuit board (3). Along the direction of an optical axis, the connecting member (2) comprises a first connecting portion (21) fixedly connected to the lens (1) and a second connecting portion (22) connected to the circuit board (3); a correction plane (4) is provided on one side, facing the second connecting portion (22), of the first connecting portion (21), or a correction plane (4) is provided on one side, close to the circuit board (3), of the second connecting portion (22); the correction plane (4) is parallel to an imaging plane of the lens (1); a connecting adhesive layer (A) having a predetermined thickness is provided between the correction plane (4) and the second connecting portion (22) or between the correction plane (4) and the circuit board (3). The camera module can ensure that the thickness of the filled glue is consistent in the AA manufacture procedure, and the shrinkage amount of the glue is consistent, thereby improving the consistency and qualified rate of products.
Inventors:
張 ▲コウ▼文
Liu Zhaoqing
Huh Yin Feng
農 開▲クン▼
Zhou Dichou
Liu Zhaoqing
Huh Yin Feng
農 開▲クン▼
Zhou Dichou
Application Number:
JP2022567536A
Publication Date:
March 01, 2024
Filing Date:
June 30, 2020
Export Citation:
Assignee:
ZHEJIANG SUNNY SMARTLEAD TECHNOLOGIES CO.,LTD.
International Classes:
G02B7/02
Domestic Patent References:
| JP2019113711A | ||||
| JP2017181769A | ||||
| JP61245774A |
Foreign References:
| CN101001324A | ||||
| CN105842960A | ||||
| US20190381952 |
Attorney, Agent or Firm:
Patent Attorney Corporation Goto Patent Office