Title:
放熱装置及びこれを用いたアンテナアセンブリ
Document Type and Number:
Japanese Patent JP7474868
Kind Code:
B2
Abstract:
A heat dissipation apparatus and antenna assembly using the same is disclosed herein. According to an embodiment of the present disclosure, a heat dissipation apparatus configured to cool a circuit board including at least one heat generation element is provided, the heat dissipation apparatus including: a plate disposed to face the circuit board; a plurality of first heat dissipation fins disposed in a first direction on one surface of the plate spaced apart from the circuit board; and a blowing unit disposed to face the one surface of the plate, the blowing unit including at least one fan configured to discharge air toward the one surface of the plate, wherein a space between two adjacent first heat dissipation fins defines a side flow path configured to guide the air discharged from the at least one fan.
Inventors:
Duk Young Kim
Kyu Chul Chae
In Hwa Che
Young Jun Cho
Jae Hyun Park
Kyosunji
Hey Young Kim
Chi Baku Ryu
Jeong Hyun Chae
Choi Ho Chan
Kyu Chul Chae
In Hwa Che
Young Jun Cho
Jae Hyun Park
Kyosunji
Hey Young Kim
Chi Baku Ryu
Jeong Hyun Chae
Choi Ho Chan
Application Number:
JP2022566184A
Publication Date:
April 25, 2024
Filing Date:
April 26, 2021
Export Citation:
Assignee:
KW Incorporated
International Classes:
H05K7/20; H01L23/467; H01Q23/00
Domestic Patent References:
| JP6104586A | ||||
| JP2019036694A | ||||
| JP11135970A |
Attorney, Agent or Firm:
Patent Attorney Corporation Aimee International Patent Office