Title:
ポジ型感光性樹脂組成物、パターン硬化膜およびその製造方法
Document Type and Number:
Japanese Patent JP7482637
Kind Code:
B2
Abstract:
To provide a positive photosensitive resin composition which hardly causes tackiness in the positive photosensitive resin composition and gives a cured film excellent in reworkability.SOLUTION: The positive photosensitive resin composition contains a component (A): a compound whose alkali solubility increases by the action of an acid, a component (B): a photoacid generator, and a component (C): a copolymer which is composed of two or more monomers selected from the group consisting of (meth)acrylic acid, a (meth)acrylate, styrene, a styrene derivative, and maleic anhydride, provided that at least one of (meth)acrylic acid and maleic anhydride is an essential component. The content of the component (C) is 1-10 pts.wt. based on 100 pts.wt. of the component (A).SELECTED DRAWING: None
Inventors:
Kohei Fujimoto
Arihiro Saito
Hiroshi Inari
Arihiro Saito
Hiroshi Inari
Application Number:
JP2020014143A
Publication Date:
May 14, 2024
Filing Date:
January 30, 2020
Export Citation:
Assignee:
Kaneka Corporation
International Classes:
G03F7/039; C08K5/13; C08L83/07; G03F7/20
Domestic Patent References:
| JP2017083592A |