Title:
感光性樹脂組成物、硬化膜、硬化膜を備えるパネルレベルパッケージ及びその製造方法
Document Type and Number:
Japanese Patent JP7487518
Kind Code:
B2
Abstract:
To provide a photosensitive resin composition capable of forming a uniform coating film and having good wettability.SOLUTION: There is provided a photosensitive resin composition for permanent film formation which is used in a panel level package process and comprises an alkali-soluble resin (A), a photosensitive agent (B) and a solvent (C), wherein the solvent (C) includes a solvent (C-1) having a glycol ether structure which is water soluble and has a boiling point of 130°C or more.SELECTED DRAWING: None
Inventors:
Sakiko Suzuki
Application Number:
JP2020058210A
Publication Date:
May 21, 2024
Filing Date:
March 27, 2020
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
G03F7/004; G03F7/023; G03F7/16; G03F7/20
Domestic Patent References:
| JP2004054254A | ||||
| JP2018146978A | ||||
| JP2005292276A | ||||
| JP2003156838A | ||||
| JP7001147B2 | ||||
| JP2020024247A |
Attorney, Agent or Firm:
Shinji Hayami