Document Type and Number:
Japanese Patent JPH0343027
Kind Code:
B2
Abstract:
A polishing apparatus is provided with a fixed gear (13) and at least one planet gear (18) which meshes with the fixed gear to make at least one spindle (17) coupled to said planet gear perform orbital revolution and own rotation by making the planet gear rotate around its own axis while orbitally revolving said planet gear around the fixed gear, thus rotating the workpieces (24) fitted to said spindle in a polishing bath (1) to be subject to fluidized polishing with the media (2) filled up in the polishing bath, wherein said spindle is formed as a cylinder in which a rotary shaft (19) is arranged rotatably and a rotating mechanism (14, 20) for rotating the rotary shaft is provided to rotate the workpieces by means of said rotary shaft, thus permitting the work pieces to be uniformly polished.
Inventors:
MATSUMOTO HIROSHI
FUJIKI MITSURU
FUJIKI MITSURU
Application Number:
JP22641183A
Publication Date:
July 01, 1991
Filing Date:
November 30, 1983
Export Citation:
Assignee:
UEMURA KOGYO KK
International Classes:
B24B31/10; B24B31/00