Title:
【考案の名称】実装基板
Document Type and Number:
Japanese Patent JPH04130438
Kind Code:
U
Abstract:
A board for installation in a liquid crystal panel with at least one slit at a portion thereof to be bent has a resin coating applied to a bridge portion of a conductive pattern formed over the slit. The resin coating resists external load applied during bending of the board. This board may be made by a method having the steps of punching a slit in the board corresponding to a position where the board is to be bent; forming a metal laminate on the board; forming a conductive pattern by etching the metal laminate; applying a resin coating capable of resisting an external load, which is applied during subsequent bending of the board, onto the conductive pattern across the slit; and curing the resin coating. The board is thereafter bent and installed in a liquid crystal panel.
Inventors:
Naoyuki Tajima
Takaaki Tsuda
Takaaki Tsuda
Application Number:
JP3560391U
Publication Date:
November 30, 1992
Filing Date:
May 21, 1991
Export Citation:
International Classes:
H01L21/60; H01L23/14; H05K1/00; H05K1/02; G02F1/13; H05K3/28; H05K3/36; (IPC1-7): H01L21/60; H05K1/02
Domestic Patent References:
| JPH02185051A | 1990-07-19 | |||
| JPS58106887A | 1983-06-25 | |||
| JPH03297192A | 1991-12-27 |