Title:
【考案の名称】ベアチップの樹脂封止枠の取付構造
Document Type and Number:
Japanese Patent JPH0590956
Kind Code:
U
Inventors:
Murai Makoto
Application Number:
JP3248092U
Publication Date:
December 10, 1993
Filing Date:
May 18, 1992
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L21/56; H01L23/28; H05K1/18; (IPC1-7): H01L23/28; H01L21/56; H05K1/18
Attorney, Agent or Firm:
Noriyuki Noriyuki
Next Patent: フリップチップのコーティング構造