Title:
【発明の名称】付着性の向上したハロゲン化ポリイミド組成物およびそれを用いて製造された製品
Document Type and Number:
Japanese Patent JPH0661897
Kind Code:
B2
Abstract:
A limited quantity of water is added to a halogenated polyamic acid to form a reaction product, which is then sprayed, degreased, oxidized and cured into a layer of the modified polyimide composition. The chemically modified surface is then electrolessly plated with a primary metal layer followed by one or nore electrolessly or electrolytically applied secondary metal layers until the metal layer of a desired thickness is attained. The present invention further discloses articles such as an EMI shielded enclosure and an insulated mold surface, having metal layers as an EMI shield and an insulating surface, respectively.
Inventors:
Charles Edward Baumgartner
Lisa Lenny Scott
Lisa Lenny Scott
Application Number:
JP9634193A
Publication Date:
August 17, 1994
Filing Date:
April 23, 1993
Export Citation:
Assignee:
GENERAL ELECTRIC COMPANY
International Classes:
B29C33/38; B32B15/088; C08G73/10; C23C18/16; C23C18/18; C23C18/20; B32B7/04; H05K1/03; H05K3/18; H05K3/38; (IPC1-7): B32B15/08; B29C33/38; B32B7/04; C08G73/10; C23C18/16
Attorney, Agent or Firm:
Tokunji Ikunuma
Next Patent: 高所作業車の走行安全装置