Title:
【発明の名称】表面処理方法
Document Type and Number:
Japanese Patent JPH0689462
Kind Code:
B2
Abstract:
In a pulsed plasma process for surface treatment of a substrate the containing reactor vessel (11) has an inner cross-section conforming to the substrate geometry so as to confine the intense plasma region to the substrate surface (12). Preferably this region should be within 15 to 20 mm of the surface.
Inventors:
Rudolf August Herbert Heinetzke
Shresh Yuchi Yandra Missile Rural
Ian Paul Rewellin
Shresh Yuchi Yandra Missile Rural
Ian Paul Rewellin
Application Number:
JP27883885A
Publication Date:
November 09, 1994
Filing Date:
December 11, 1985
Export Citation:
Assignee:
STC PLC
International Classes:
B01J19/08; B05D3/06; C23C14/40; C23C14/48; H01L21/302; C23C16/50; C23C16/515; C23F1/08; C23F4/00; H01J37/32; H01L21/203; H01L21/306; H01L21/3065; (IPC1-7): C23F4/00; C23C16/50; H01L21/302
Domestic Patent References:
| JP59171491A | ||||
| JP60215777A | ||||
| JP54103165U |
Attorney, Agent or Firm:
Tadahiko Ito
Next Patent: DEVICE FOR OPTICAL MEMORY AND PRODUCTION THEREOF