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Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JPH0712084
Kind Code:
B2
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Inventors:
Shuji Toyoda
Sakai Isumi
Application Number:
JP9222087A
Publication Date:
February 08, 1995
Filing Date:
April 14, 1987
Export Citation:
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Assignee:
NEC
International Classes:
H01L21/306; H01L21/336; H01L29/78; (IPC1-7): H01L29/78; H01L21/336
Domestic Patent References:
JP60145664A
JP61207076A
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)



 
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