Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JPH0770552
Kind Code:
B2
Inventors:
Shigekichi Yoshida
Application Number:
JP7184286A
Publication Date:
July 31, 1995
Filing Date:
March 29, 1986
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L21/52; H01L; (IPC1-7): H01L21/52
Domestic Patent References:
| JP6055633A | ||||
| JP5976458A | ||||
| JP5828168U | ||||
| JP58158452U |
Attorney, Agent or Firm:
Kenichi Hayase
Next Patent: ABRASIVE FLUID AND GRINDING OF SUBSTRATE THEREWITH