Title:
【発明の名称】デバイスの製造方法
Document Type and Number:
Japanese Patent JPH0785470
Kind Code:
B2
Abstract:
A method of manufacturing a device, preferably a semiconductor device, whereby a mask (3) with an opening (4) extending down to a bare body (1) is provided on a surface (2) of this body (1), after which a substance (5) is implanted into the body (1) through the opening (4), upon which the mask (3) is removed. The mask (3) is provided by depositing a first and a second layer (6, 7, respectively) on the surface (2), and these layers are provided with the opening (4), while the first layer (6) can be selectively removed relative to the material of the body (1), and the second layer (7) is of the same material as the body (1). Since the same material is used for the second layer (7) as for the body (1), the body (1) is not polluted with material from the mask (3) in the opening (4) during implantation.
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Inventors:
OOSTRA DOEKE JOLT (NL)
OUWERLING GERARDUS JOHANNES L (NL)
OTTENHEIM JOZEF JACOBUS MARIA (NL)
ROOIJ-MULDER JOHANNA MARIA VAN (NL)
OUWERLING GERARDUS JOHANNES L (NL)
OTTENHEIM JOZEF JACOBUS MARIA (NL)
ROOIJ-MULDER JOHANNA MARIA VAN (NL)
Application Number:
JP25288192A
Publication Date:
September 13, 1995
Filing Date:
September 22, 1992
Export Citation:
Assignee:
KONINKL PHILIPS ELECTRONICS NV (NL)
International Classes:
H01L21/265; H01L21/266; H01L21/28; H01L21/335; H01L21/74; (IPC1-7): H01L21/266; H01L21/28
Domestic Patent References:
| JP6246517A | ||||
| JP1173713A | ||||
| JP5081264A |
Attorney, Agent or Firm:
Akihide Sugimura (5 outside)