【発明の名称】高密度多層配線基板実装構造

Title:

【発明の名称】高密度多層配線基板実装構造

Document Type and Number:

Japanese Patent JPH0815175

Kind Code:

B2

Inventors:

Mitsutaka Yoshida
Hiroshi Hasegawa
Ryohei Sato
Mitsuyoshi Tani
Nezu Toshichu
Yoshiyuki Osawa

Application Number:

JP609687A

Publication Date:

February 14, 1996

Filing Date:

January 16, 1987

Export Citation:

Assignee:

株式会社日立製作所

International Classes:

H01L23/52; H01L21/66; H05K3/46; (IPC1-7): H01L21/66; H01L23/52; H05K3/46

Domestic Patent References:

Attorney, Agent or Firm:

Akio Takahashi (1 person outside)

Next Patent: ＩＣオートハンドラにおけるＩＣ搬送・測定方法および装置