Title:
【発明の名称】バインディングアセンブリ
Document Type and Number:
Japanese Patent JPH10501194
Kind Code:
A
Abstract:
A binding assembly including (1) a plurality of support strips; (2) layers of pressure sensitive adhesive (which could be repositionable, removable or permanent pressure sensitive adhesive) along front surfaces of the support strips; and (3) layers of release material on rear surfaces of the support strips. The support strips are adhered together to form a support strip stack with inner edges of the support strips in alignment, with the layers of pressure sensitive adhesive on the support strips adhered to the layers of release material on adjacent support strips, and with the front surfaces of the support strips uppermost in the support strip stack. The binding assembly further includes binding means along the inner edges of the support strips that affords separation of the support strips and revolving of the support strips relative to each other around axes generally parallel to their inner edges. Only tension applied through a paper sheet adhered along the full length of the layer of pressure sensitive adhesive on the uppermost one of the support strips adhered in the support strip stack can be used to separate that one support strip from an adjacent support strip adhered to the layer of release material on the front surface of that one support strip and cause revolving of that one support strip away from the support strip from which that one support strip was separated.
More Like This:
| WO/1995/034431 | BINDING ASSEMBLY |
Inventors:
Immel, John Jay
Bayer, Glenn H. Junior
Windleski, David Sea
Orally, Timothy Jay
Miller-Brands, Mary Kay
Bayer, Glenn H. Junior
Windleski, David Sea
Orally, Timothy Jay
Miller-Brands, Mary Kay
Application Number:
JP50215296A
Publication Date:
February 03, 1998
Filing Date:
May 04, 1995
Export Citation:
Assignee:
Minnesota Mining and Manufacturing Company
International Classes:
B42D1/10; B42F11/00; (IPC1-7): B42D1/10; B42F11/00
Attorney, Agent or Firm:
Aoyama Ryo (1 person outside)