Title:
【発明の名称】三次元回路装置の製造方法
Document Type and Number:
Japanese Patent JPH10502493
Kind Code:
A
Abstract:
PCT No. PCT/DE95/00857 Sec. 371 Date Dec. 20, 1996 Sec. 102(e) Date Dec. 20, 1996 PCT Filed Jul. 3, 1995 PCT Pub. No. WO96/01497 PCT Pub. Date Jan. 18, 1996In order to produce a three-dimensional circuit arrangement, two substrates (21, 26) which have components in the region of their boundary surfaces (22, 27) which touch one another are stacked one on top of the other. The substrates (21, 26) are firmly connected to one another via these boundary surfaces (22, 27). One of the substrates (21) can subsequently be thinned from the rear side (212) and can be provided with rear-side contacts (213), the other substrate (26) acting as a stabilizing supporting plate.
Inventors:
Hiyupner, Holger
Application Number:
JP50362396A
Publication Date:
March 03, 1998
Filing Date:
July 03, 1995
Export Citation:
Assignee:
Siemens Aktiengesellschaft
International Classes:
H01L25/18; H01L21/98; H01L25/065; H01L25/07; H01L27/00; (IPC1-7): H01L27/00; H01L25/18; H01L25/07; H01L25/065
Attorney, Agent or Firm:
Tomimura Kiyoshi