Document Type and Number:
Japanese Patent JPS491679
Kind Code:
A
Abstract:
Designed for the bonding of e.g. glass to metal, as in the assembly of cathode ray tubes or integrated circuits (pref. Mylar) plastic is placed between the individual components and heated so that the plastic metals to give a bond at temps. m.pt. of glass and/or metal to prevent damage. Areas to be heated are painted black to absorb the heat, while other areas are silvered to reflect the heat so that they are unaffected by the bonding process.
More Like This:
| JPH08206155 | METHOD AND DEVICE TO PACKAGE TAMPON |
| WO/2019/217656 | METHODS TO HEAT SEAL FILMS |
Application Number:
JP2722973A
Publication Date:
January 09, 1974
Filing Date:
March 09, 1973
Export Citation:
International Classes:
B29C65/02; B32B17/10; C03C27/04; F16B5/08; G02F1/1339; B29C65/16; (IPC1-7): C09J5/10
Next Patent: SUPERSONIC MOTOR